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 FS50SMJ-3
High-Speed Switching Use Nch Power MOS FET
REJ03G1423-0300 Rev.3.00 Nov 21, 2006
Features
* * * * * Drive voltage : 4 V VDSS : 150 V rDS(ON) (max) : 30 m ID : 50 A Integrated Fast Recovery Diode (TYP.) : 125 ns
Outline
RENESAS Package code: PRSS0004ZB-A (Package name: TO-3P)
4 2, 4
1 1
1. 2. 3. 4.
Gate Drain Source Drain
2
3 3
Applications
Motor control, Lamp control, Solenoid control, DC-DC converters, etc.
Maximum Ratings
(Tc = 25C)
Parameter Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Avalanche drain current (Pulsed) Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Mass Symbol VDSS VGSS ID IDM IDA IS ISM PD Tch Tstg -- Ratings 150 20 50 200 50 50 200 150 - 55 to +150 - 55 to +150 4.8 Unit V V A A A A A W C C g Conditions VGS = 0 V VDS = 0 V
L = 100 H
Typical value
Rev.3.00
Nov 21, 2006
page 1 of 6
FS50SMJ-3
Electrical Characteristics
(Tch = 25C)
Parameter Drain-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time Symbol V(BR)DSS IGSS IDSS VGS(th) rDS(ON) rDS(ON) VDS(ON) | yfs | Ciss Coss Crss td(on) tr td(off) tf VSD Rth(ch-c) trr Min 150 -- -- 1.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- 1.5 23 24 0.58 62 8200 870 440 54 110 850 340 1.0 -- 125 Max -- 0.1 0.1 2.0 30 31 0.75 -- -- -- -- -- -- -- -- 1.5 0.83 -- Unit V A mA V m m V S pF pF pF ns ns ns ns V C/W ns Test Conditions ID = 1 mA, VGS = 0 V VGS = 20 V, VDS = 0 V VDS = 150 V, VGS = 0 V ID = 1 mA, VDS = 10 V ID = 25 A, VGS = 10 V ID = 25 A, VGS = 4 V ID = 25 A, VGS = 10 V ID = 25 A, VDS = 10 V VDS = 10 V, VGS = 0 V, f = 1MHz VDD = 80 V, ID = 25 A, VGS = 10 V, RGEN = RGS = 50 IS = 25 A, VGS = 0 V Channel to case IS = 50 A, dis/dt = - 100 A/s
Rev.3.00
Nov 21, 2006
page 2 of 6
FS50SMJ-3
Performance Curves
Power Dissipation Derating Curve
200 3 2
Maximum Safe Operating Area
tw =
Power Dissipation PD (W)
10
Drain Current ID (A)
160
120
102 7 5 3 2 101 7 5 3 2
10 0 s
s
DC
80
40
0
0
50
100
150
200
100 Tc = 25C 7 Single Pulse 5 30 10 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
Case Temperature Tc (C)
Drain-Source Voltage VDS (V)
Output Characteristics (Typical)
100
VGS = 10V 5V 4V
Output Characteristics (Typical)
50
VGS = 10V 5V 4V 3V
Tc = 25C Pulse Test
Drain Current ID (A)
60
3V
Drain Current ID (A)
80
40
30
40
PD = 150W
20
2.5V
20
10
Tc = 25C Pulse Test
0 0 1.0 2.0 3.0 4.0 5.0 0 0 0.4 0.8 1.2 1.6 2.0
Drain-Source Voltage VDS (V)
Drain-Source Voltage VDS (V)
Drain-Source On-State Voltage VDS(ON) (V)
Drain-Source On-State Resistance rDS(ON) (m)
On-State Voltage vs. Gate-Source Voltage (Typical)
2.0
ID = 100A
On-State Resistance vs. Drain Current (Typical)
40
Tc = 25C Pulse Test
32
1.6
80A
1.2
50A
24
VGS = 4V 10V
0.8
16
0.4
Tc = 25C Pulse Test
20A
8 0
0
0
2
4
6
8
10
3 5 7 100 2 3 5 7 101 2 3 5 7 102 2 3
Gate-Source Voltage VGS (V)
Drain Current ID (A)
Rev.3.00
Nov 21, 2006
page 3 of 6
FS50SMJ-3
Forward Transfer Admittance vs. Drain Current (Typical)
Forward Transfer Admittance | yfs | (S)
102 7 5 4 3 2 101 7 5 4 3 2 100 0 10 2 3 4 5 7 101
75C 125C
Transfer Characteristics (Typical)
100
Drain Current ID (A)
80
Tc = 25C VDS = 10V Pulse Test
TC = 25C
60
40
20
VDS = 10V Pulse Test
2 3 4 5 7 102
0
0
2
4
6
8
10
Gate-Source Voltage VGS (V) Capacitance vs. Drain-Source Voltage (Typical)
2 104 7 5 3 2 103 7 5 3 2 102 7 5 3 2
Ciss
Drain Current ID (A)
Switching Characteristics (Typical)
104 7 5 3 2 103 7 5 3 2 102 7 5 3 2 101 0 10 23
td(off) tf
Capacitance C (pF)
Coss
Crss
Switching Time (ns)
Tch = 25C VDD = 80V VGS = 10V RGEN = RGS = 50
tr td(on)
Tch = 25C f = 1MHz VGS = 0V
3 5 7100 2 3 5 7 101 2 3 5 7 102 2 3
5 7 101
23
5 7 102
Drain-Source Voltage VDS (V) Gate-Source Voltage vs. Gate Charge (Typical)
10 100
Drain Current ID (A) Source-Drain Diode Forward Characteristics (Typical)
VGS = 0V Pulse Test
Gate-Source Voltage VGS (V)
Tch = 25C ID = 50A
8
Source Current IS (A)
VDS = 50V
80
Tc = 125C
6
80V 100V
60
75C 25C
4
40
2
20
0
0
40
80
120
160
200
0
0
0.4
0.8
1.2
1.6
2.0
Gate Charge Qg (nC)
Source-Drain Voltage VSD (V)
Rev.3.00
Nov 21, 2006
page 4 of 6
FS50SMJ-3
On-State Resistance vs. Channel Temperature (Typical)
101 7 5 3 2 100 7 5 3 2 10-1 -50 0 50 100 150
Drain-Source On-State Resistance rDS(ON) (25C)
Gate-Source Threshold Voltage VGS(th) (V)
Drain-Source On-State Resistance rDS(ON) (tC)
Threshold Voltage vs. Channel Temperature (Typical)
4.0
VGS = 10V ID = 25A Pulse Test
VDS = 10V ID = 1mA
3.2
2.4
1.6
0.8
0
-50
0
50
100
150
Channel Temperature Tch (C)
Channel Temperature Tch (C)
Drain-Source Breakdown Voltage V(BR)DSS (25C)
Transient Thermal Impedance Zth(ch-c) (C/W)
Drain-Source Breakdown Voltage V(BR)DSS (tC)
Breakdown Voltage vs. Channel Temperature (Typical)
1.4
Transient Thermal Impedance Characteristics
101 7 5 3 2 100 D = 1.0 7 5 0.5 3 0.2 2
0.1
VGS = 0V ID = 1mA
1.2
1.0
0.8
PDM
tw
0.6
10-1 7 5 3 2
0.05 0.02 0.01 Single Pulse
T D= tw T
0.4
-50
0
50
100
150
10-2 -4 10 2 3 5710-3 2 3 5710-22 3 5710-12 3 57100 2 3 57101 2 3 57102
Channel Temperature Tch (C)
Pulse Width tw (s)
Switching Time Measurement Circuit
Vin Monitor D.U.T. RL Vin Vout RGS VDD Vout Monitor
Switching Waveform
90%
RGEN
10% 10% 10%
90% td(on) tr
90% td(off) tf
Rev.3.00
Nov 21, 2006
page 5 of 6
FS50SMJ-3
Package Dimensions
Package Name TO-3P* JEITA Package Code SC-65 RENESAS Code PRSS0004ZB-A Previous Code MASS[Typ.] 4.8g
Unit: mm
15.9Max
4.5 1.5
5.0 3.2 2
2
4
20.0
4.4
1.0
19.5Min
0.6 5.45 5.45
2.8
4
Order Code
Lead form Standard packing Quantity Standard order code Standard order code example FS50SMJ-3 FS50SMJ-3-A8
Straight type Static electricity prevention bag 20 Type name Lead form Plastic Magazine (Tube) 30 Type name - Lead forming code Note : Please confirm the specification about the shipping in detail.
Rev.3.00
Nov 21, 2006
page 6 of 6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0


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